The authors are grateful for the financial support from Ministry of Science and Technology.

シルバー前駆体インクの調製<ol><li> 3.15ミリリットルの脱イオン水にジエタノールアミン1.85グラム（DEA）を追加します。 </li><li> 5ml中の硝酸銀の脱イオン水0.15グラムを溶かします。 </li><li>使用直前に10 mlの銀前駆体インクを持っている1体積比：1でDEAと硝酸銀水溶液を混合します。 </li></ol>伸縮性導電性薄膜の作製2。 <ol><li> AgNWインクの調製 <ol><li> 18ミリリットルの脱イオン水とイソプロパノール0.5重量％のAgNWsの2ミリリットルを希釈します。 </li><li> 25℃で30秒間超音波浴中に配置します。 </li></ol></li><li> 自動スプレー塗装によりAgNW薄膜の作製 <ol><li> 1×2.5センチメートル2に等しいサイズのピースにスライドし、標準的な顕微鏡をカットします。このサイズの16ガラス片を作製し、エタノール湿らせたレンズクリーニングティッシュでそれらを清掃してください。 </li><li> airbrの塗料カップに（部1から）転送16ミリリットルAgNWインクピペットでUSH。スプレー塗装用コンピュータ制御ロボットにエアブラシをマウントします。 </li><li>ステージ上で4×2の構成ではガラス片の8を配置し、耐熱テープで固定します。ステージ上のすべてのガラス基板の総面積は4×5 cm 2です。 </li><li>別に、3バールおよび100℃での使用圧力と加熱ステージの温度を設定します。 </li><li>ロボット制御ソフトウェアを開きます。 「コマンド」列の下にブラシモーションコマンドシーケンスをクリックして選択します。 図1に示すように、自動噴霧プログラムを完了するために必要な入力パラメータを入力します。プログラムを実行します。 注意：「回線速度」コマンドでは、200ミリメートル/秒でエアブラシの旅行になります。 「ブラシ領域」コマンドにより、エアブラシは、ガラス基板の短辺方向に前後に移動する長辺方向に沿ってステージを移動すると2つのストローク間の空間ながら配列は5mmです。 「ラインスタート &quot;と&quot;林Eの終了」コマンドは、自動噴霧操作の開始点と終了点の位置を決定する。それらの位置は、ステージ上のガラス基板のアレイの位置に依存しています。「ポイントを待って &quot;コマンドは、20秒の待機時間を設定します各自動噴霧サイクルの終わり。コマンド」をループアドレス」は、複数の噴霧サイクルを可能にし、自動噴霧サイクル数は15回です。コマンドのより詳細な指示は、製造業者のプロトコルに記載されています。 </li><li> 30回に自動噴霧サイクル数を変更します。 30噴霧サイクルのAgNW薄膜を作製するために2.2.5 - 繰り返して、2.2.3を繰り返します。 </li><li>スプレーコーティングした後、10分間、120℃のホットプレート上の銀ナノワイヤ薄膜を焼きます。 </li></ol></li><li> 化学はんだ付けプロセス <ol><li>ガラス基板上の各スプレー塗布銀ナノワイヤ薄膜の上に銀前駆体インクの400μLをキャストします。 </li><li> 100のホットプレート上の膜を焼きます＃176; C 40分間。 </li><li>非反応化学残基および空気乾燥塗膜を除去するために、脱イオン水で慎重に反応性コーティングを洗い流します。 </li></ol></li><li> キャスト・剥離工程 <ol><li>ガラス基板上の各銀ナノコンポジット薄膜の上に200μlの市販の水ベースのPUエマルジョンをキャストします。 </li><li>完全に凝固を確実にするために、10時間にわたってフィルム空気が乾燥します。 </li><li>自立複合フィルムなどのガラス基板からサンプルをはがし。 </li></ol></li></ol> 3.特性評価<ol><li> ストレッチテスト <ol><li>リニアモーター駆動ステージをオンにして、マシンがウォームアップするために10分を待ちます。 </li><li>ステージ制御ソフトウェアを開きます。 8000ように、モータの移動ステップ数を設定します。それは固定ステージに接触するまで、モバイルのステージを移動するステージ制御ソフトウェアの「X +」をクリックして、Tの位置を設定するには、「0を設定」をクリックステージ制御ソフトウェアのゼロとして、彼の携帯のステージ。 注意：モバイルステージは、モータの1ステップで0.00125ミリメートルを移動します。モータは8,000ステップを移動した場合例えば、移動ステージは1cmに移動します。 「X +」のプラス記号は &quot;X-&quot;の負の符号が離れて固定ステージから移動することを意味しな​​がら、固定ステージに近づく方向でモバイルステージが移動することを意味します。 </li><li>モバイルと固定ステージの間に1cmのスペースを残すために、モバイル、ステージを移動するために &quot;X-&quot;をクリックしてください。ステージ上に有線ホルダーとサンプルの両端を固定します。これにより、サンプルの伸び面積は1×1 cm 2です。延伸機の設定は、図2に示されています。 </li><li>抵抗測定用のデジタルマルチメータに接続するには、ステージ所有者への配線ケーブルのもう一方の端（ 図2）は、ワニ口クリップを使用します。 </li><li> MOVへの800をクリックして「X-」とモータの移動ステップ数を設定します。電子離れて固定ステージから移動ステージ1ミリ（10％株）は、サンプルを伸ばし、抵抗を記録します。かなり抵抗が増加する（〜150％系統）まで、この手順を繰り返します。 </li></ol></li><li> 安定性試験 <ol><li> 3.1.4 - ステップ3.1.2のようにテストを準備します。 </li><li>デジタルマルチメータのソフトウェアを開きます。コンピュータにデジタルマルチメーターを接続します。デジタルマルチメータの長押し &quot;RELΔ」ボタンコンピュータのアイコンは、デジタルマルチメータモニターの左上隅に表示されるまで。デジタルマルチメータソフトウェアの「USB接続」をクリックして、ソフトウェアが測定された抵抗値を記録するために開始します。 </li><li> 図3に示すように、ステージ制御ソフトウエアのプログラムパネルの入力フィールドにコマンドを入力し、コマンド&quot;：U-4000」は、コマンドながら4,000歩の距離固定ステージから移動ステージを移動することを意味する&quot;：U4000」手段4000ステップバックモバイルステージを移動します固定ステージ（50％株について4000、100％の株について8000）へ。ストレッチングサイクル数は15回です。モバイルステージのデフォルトの速度を1mm / secです。 </li><li>自動プログラムを実行するステージ制御ソフトウエアのプログラムパネルで「123の実行」をクリックしてください。モバイルステージは三角波の伸長サイクルでサンプルをストレッチするための往復運動に移動します。 </li><li>マルチメータのソフトウェアで保存アイコンをクリックして、.xlsファイルとして抵抗応答プロファイルのデータをエクスポートします。 </li></ol></li><li> LED点灯試験 <ol><li> 3.1.3 - ステップ3.1.2のようにテストを準備します。 LEDと電源に直列に配線ホルダーを接続します。 </li><li>電源をオンにします。 LEDを点灯するために9 Vまで電圧を上げます。 </li><li>サンプルを伸ばし、LEDの明るさを記録するために写真を撮るために固定ステージから離れ、携帯ステージ1ミリ（10％歪み）を移動するには、 &quot;X-&quot;をクリックしてください。この手順を繰り返して、LEDの光が暗くなります。写真を撮影しながら、カメラの自動露出をオフにする必要があることに注意してください。 </li></ol></li></ol>

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The authors have nothing to disclose.

化学的なはんだ付けプロセスは、銀ナノワイヤとの間の接触を強化することができます。 図4bに示すように、ワイヤ/ワイヤ接合はAgNW薄膜スプレーコーティング上に、反応性の銀インクを塗布した後、銀で被覆されています。銀回収は、DEAの分解から発生するホルムアルデヒドに強く依存し、したがって、はんだ付けプロセスまたは銀の減少は温度上昇により加速することができ...

大きな伸縮性のある変形可能な電子機器は、次の世代のウェアラブルと携帯用電子機器の実現に不可欠な部品として同定されている。1これら伸縮性電子デバイスは、プラスチックシート上のものの電子デバイスとして大きな柔軟性を示す2、3だけでなく、優れた展示だけでなく、延伸条件やひねり厳しい下のパフォーマンス。4大変形下での優れた電気的性能と伸縮性エレクトロニクス、材料を実現するためには必要とされています。材料科学の最近の進歩は、このような機能性材料を合成する可能性を示しており、複雑な形状の変形に大きな耐性を有する伸縮性光電子デバイス5-9を設計するためにそれらを使用しています。全ての電子機能材料の中では、伸縮性の導体は、これらの光電子デバイスに電力を供給するために必要であり、従って、デバイス性能のために非常に重要です。金属またはインジウムスズ酸化物、大変形下での機械的ロバスト性の欠如のような規則的な導電性材料、ので、これらの材料で作られた相互接続は、プロセスの延伸下で良好な電気伝導性を発揮することができません。したがって、このようなカーボンナノチューブ、グラフェン1、10またはAgNWs等の可撓性導電性材料の薄い層で覆われた弾性基質は、11-14は、優れた伸縮性を有する導電体のために設計されています。そのため、高いバルク導電率の、AgNW薄膜はAgNW薄膜の13浸透ネットワークが効果的に大きな電気伝導度と延伸工程に大きな弾性変形を収容することができます。複合伸縮性導体のための最も有望な材料であることが示されている、とのように考えられています有望な伸縮性電極候補。伸縮性導体としてAgNW薄膜を実現するために、それはAgNWs間の効果的な電気接点を有することが必要です。液相堆積AN後基板表面上のD乾燥、AgNWsは定期的に大きな電気抵抗に生じる緩み接点と浸透メッシュを形成するために一緒に積み重ねます。したがって、一つの接触抵抗を低減するために、高温または高圧アニーリング方法15-20によってナノワイヤ間のコンタクトをアニールする必要があります。 文献において、これらのアニーリングプロセスとは対照的に、ここでは、我々は、通常の実験室条件下でAgNWネットワーク接続をアニールするために、単純な化学的方法を実証する。21の製造プロセスは、 図4Aに示されています。反応性インクをガラス板上の薄膜AgNWスプレーコーティングを焼結するのに使用されます。反応後、ナノワイヤ間の接触は、銀で被覆されているので、AgNWネットワークは、化学的に一緒にはんだ付けされています。キャスト及び剥離方法は、その後、明らかな変化を示さないことができる複合導体を形成するために、伸縮性PU基板に半田付けAgNWネットワークを転送するために使用されるIでも120％の大きな引張歪みにおけるn個の電気伝導度。

<table><tbody><tr><td>Silver nanowire</td><td>Sigma-Aldrich</td><td>778095-25ML</td><td>AgNW, 120 nm in diameter and 20-50 mm in length, 0.5 wt% in IPA</td></tr><tr><td>Silver nitrate crystal</td><td>Macron Fine Chemicals</td><td>MK216903</td><td></td></tr><tr><td>Diethanolamine</td><td>Sigma-Aldrich</td><td>D8885-500G</td><td></td></tr><tr><td>Polyurethane emulsion</td><td>First Chemical</td><td>20130326036</td><td>35 wt% water-based anionic polyester-polyurethane emulsion</td></tr><tr><td>Airbrush</td><td>Taiwan Airbrush &amp;amp; Equipment</td><td>AFC-sensor&amp;nbsp;</td><td></td></tr><tr><td>Desktop robot</td><td>Dispenser Tech</td><td>DT-200&amp;nbsp;</td><td></td></tr><tr><td>Digital dispenser controller</td><td>Dispenser Tech</td><td>9000E&amp;nbsp;</td><td></td></tr><tr><td>Auto-spraying program</td><td>Dispenser Tech</td><td>Smart robot edit version 3.0.0.5</td><td></td></tr><tr><td>Air compressor&amp;nbsp;</td><td>PUMA Industrial</td><td>NCS-10&amp;nbsp;</td><td></td></tr><tr><td>Linear motorized stage</td><td>TANLIAN E-O</td><td>Customized</td><td></td></tr><tr><td>Stage control software</td><td>TANLIAN E-O</td><td>Customized</td><td></td></tr><tr><td>Digital multimeter</td><td>HILA INTERNATIONAL</td><td>DM-2690TU</td><td></td></tr><tr><td>Digital multimeter software</td><td>HILA INTERNATIONAL</td><td>NA</td><td></td></tr><tr><td>Power supply</td><td>CHERN TAIH</td><td>CT-605</td><td></td></tr><tr><td>LED</td><td>PChome</td><td>M08330766</td><td>http://www.pcstore.com.tw/sun-flower/M08330766.htm</td></tr></tbody></table>

a fabrication method for highly stretchable conductors with silver nanowires

伸縮性エレクトロニクスは、次世代の電子用途のためのキーテクノロジーとして識別されます。伸縮性電子デバイスの製造における課題の一つは、優れた機械的安定性を有する伸縮性導体の製造です。本研究では、化学的に銀ナノワイヤー（AgNW）ネットワークとの間の接触点をはんだ付けするための簡単​​な製造方法を開発しました。 AgNWナノメッシュは、第一のスプレーコーティング法を介してスライドガラス上に堆積させました。銀ナノ粒子（AgNPs）前駆体から成る反応性インクはAgNW薄膜をスプレーコーティングの上に適用しました。 40分間加熱した後、AgNPsを優先AgNWナノメッシュをはんだ付けするナノワイヤ接合部に生成し、導電ネットワークを強化しました。化学的に修飾されたAgNW薄膜は、その後、キャスト法により、ポリウレタン（PU）基板に移しました。 PU上のはんだ付けAgNW薄膜は伸張またはローランの下での電気伝導度に明らかな変化を示さありませんでした伸びグラムプロセスは、120％までの株。

化学はんだ付け工程後AgNW薄膜の形態は、 図4Bに示されています。 AgNPsが優先AgNWsの表面に成長し、ワイヤ/ワイヤ接合部の上にラップ回収した。 図5は unsolderedとAgNWsの異なる量を含むはんだ付け薄膜に適用伸び株とシート抵抗の変化を示しています。化学はんだ付けプロセスの後、AgNW薄膜導体に関係なくAgNWsの噴霧量の、高ひずみ条件下で高?...

Watch this Scientific Journal Video about A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires at JoVE.com

A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

A simple synthesis method is used to chemically solder silver nanowire thin film to fabricate highly stretchable and conductive metal conductors.

シルバーナノワイヤーと伸縮性の高い導体の製造方法

Stretchable electronics are identified as a key technology for electronic applications in the next generation. One of the challenges in fabrication of ...

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9.8K ビュー.  National Taiwan University. A simple synthesis method is used to chemically solder silver nanowire thin film to fabricate highly stretchable and conductive metal conductors.

ビデオ: A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

Fabricating Nanogaps by Nanoskiving

There are several methods of fabricating nanogaps with controlled spacings, but the precise control over the sub-nanometer spacing between two electrodes-and generating them in practical quantities-is still challenging. The preparation of nanogap electrodes using nanoskiving, which is a form of edge lithography, is a fast, simple and powerful technique. This method is an entirely mechanical process which does not include any photo- or electron-beam lithographic steps and does not require any special equipment or infrastructure such as clean rooms. Nanoskiving is used to fabricate electrically addressable nanogaps with control over all three dimensions; the smallest dimension of these structures is defined by the thickness of the sacrificial layer (Al or Ag) or self-assembled monolayers. These wires can be manually positioned by transporting them on drops of water and are directly electrically-addressable; no further lithography is required to connect them to an electrometer.

The fabrication of electrically addressable, high-aspect-ratio (> 1000:1) metal nanowires separated by gaps of single nanometers using either sacrificial layers of aluminum and silver or self-assembled monolayers as templates is described. These nanogap structures are fabricated without a clean room or any photo- or electron-beam lithographic processes by a form of edge lithography known as nanoskiving.

Nanoskivingによるナノギャップを作製

There are several methods of fabricating nanogaps with controlled spacings, but the precise control over the sub-nanometer spacing between two ...

化学

Fabricating Metamaterials Using the Fiber Drawing Method

Metamaterials are man-made composite materials, fabricated by assembling components much smaller than the wavelength at which they operate 1. They owe their electromagnetic properties to the structure of their constituents, instead of the atoms that compose them. For example, sub-wavelength metal wires can be arranged to possess an effective electric permittivity that is either positive or negative at a given frequency, in contrast to the metals themselves 2. This unprecedented control over the behaviour of light can potentially lead to a number of novel devices, such as invisibility cloaks 3, negative refractive index materials 4, and lenses that resolve objects below the diffraction limit 5. However, metamaterials operating at optical, mid-infrared and terahertz frequencies are conventionally made using nano- and micro-fabrication techniques that are expensive and produce samples that are at most a few centimetres in size 6-7. Here we present a fabrication method to produce hundreds of meters of metal wire metamaterials in fiber form, which exhibit a terahertz plasmonic response 8. We combine the stack-and-draw technique used to produce microstructured polymer optical fiber 9 with the Taylor-wire process 10, using indium wires inside polymethylmethacrylate (PMMA) tubes. PMMA is chosen because it is an easy to handle, drawable dielectric with suitable optical properties in the terahertz region; indium because it has a melting temperature of 156.6 &deg;C which is appropriate for codrawing with PMMA. We include an indium wire of 1 mm diameter and 99.99% purity in a PMMA tube with 1 mm inner diameter (ID) and 12 mm outside diameter (OD) which is sealed at one end. The tube is evacuated and drawn down to an outer diameter of 1.2 mm. The resulting fiber is then cut into smaller pieces, and stacked into a larger PMMA tube. This stack is sealed at one end and fed into a furnace while being rapidly drawn, reducing the diameter of the structure by a factor of 10, and increasing the length by a factor of 100. Such fibers possess features on the micro- and nano- scale, are inherently flexible, mass-producible, and can be woven to exhibit electromagnetic properties that are not found in nature. They represent a promising platform for a number of novel devices from terahertz to optical frequencies, such as invisible fibers, woven negative refractive index cloths, and super-resolving lenses.

Metamaterials at terahertz frequencies offer unique opportunities, but are challenging to fabricate in bulk. We adapt the fabrication procedure for microstructured polymer optical fibers to inexpensively fabricate metamaterials potentially on an industrial scale. We produce polymethylmethacrylate fibers containing ~10 &mu;m diameter indium wires separated by ~100 &mu;m, which exhibit a terahertz plasmonic response.

ファイバー描画法を用いたメタマテリアルの作製

Metamaterials are man-made composite materials, fabricated by assembling components much smaller than the wavelength at which they operate 1. They owe ...

工学

A Method to Fabricate Disconnected Silver Nanostructures in 3D

The standard nanofabrication toolkit includes techniques primarily aimed at creating 2D patterns in dielectric media. Creating metal patterns on a submicron scale requires a combination of nanofabrication tools and several material processing steps. For example, steps to create planar metal structures using ultraviolet photolithography and electron-beam lithography can include sample exposure, sample development, metal deposition, and metal liftoff. To create 3D metal structures, the sequence is repeated multiple times. The complexity and difficulty of stacking and aligning multiple layers limits practical implementations of 3D metal structuring using standard nanofabrication tools. Femtosecond-laser direct-writing has emerged as a pre-eminent technique for 3D nanofabrication.1,2 Femtosecond lasers are frequently used to create 3D patterns in polymers and glasses.3-7 However, 3D metal direct-writing remains a challenge. Here, we describe a method to fabricate silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm. The method enables the fabrication of patterns not feasible using other techniques, such as 3D arrays of disconnected silver voxels.8 Disconnected 3D metal patterns are useful for metamaterials where unit cells are not in contact with each other,9 such as coupled metal dot10,11or coupled metal rod12,13 resonators. Potential applications include negative index metamaterials, invisibility cloaks, and perfect lenses.
In femtosecond-laser direct-writing, the laser wavelength is chosen such that photons are not linearly absorbed in the target medium. When the laser pulse duration is compressed to the femtosecond time scale and the radiation is tightly focused inside the target, the extremely high intensity induces nonlinear absorption. Multiple photons are absorbed simultaneously to cause electronic transitions that lead to material modification within the focused region. Using this approach, one can form structures in the bulk of a material rather than on its surface.
Most work on 3D direct metal writing has focused on creating self-supported metal structures.14-16 The method described here yields sub-micrometer silver structures that do not need to be self-supported because they are embedded inside a matrix. A doped polymer matrix is prepared using a mixture of silver nitrate (AgNO3), polyvinylpyrrolidone (PVP) and water (H2O). Samples are then patterned by irradiation with an 11-MHz femtosecond laser producing 50-fs pulses. During irradiation, photoreduction of silver ions is induced through nonlinear absorption, creating an aggregate of silver nanoparticles in the focal region. Using this approach we create silver patterns embedded in a doped PVP matrix. Adding 3D translation of the sample extends the patterning to three dimensions.

Femtosecond-laser direct-writing is frequently used to create three-dimensional (3D) patterns in polymers and glasses. However, patterning metals in 3D remains a challenge. We describe a method for fabricating silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm.

3Dで切断された銀ナノ構造体を製造する方法

The standard nanofabrication toolkit includes  techniques primarily aimed at creating 2D patterns in dielectric media. Creating  metal patterns on a ...

Planar and Three-Dimensional Printing of Conductive Inks

Printed electronics rely on low-cost, large-area fabrication routes to create flexible or multidimensional electronic, optoelectronic, and biomedical devices1-3. In this paper, we focus on one- (1D), two- (2D), and three-dimensional (3D) printing of conductive metallic inks in the form of flexible, stretchable, and spanning microelectrodes.
Direct-write assembly4,5 is a 1-to-3D printing technique that enables the fabrication of features ranging from simple lines to complex structures by the deposition of concentrated inks through fine nozzles (~0.1 - 250 &mu;m). This printing method consists of a computer-controlled 3-axis translation stage, an ink reservoir and nozzle, and 10x telescopic lens for visualization. Unlike inkjet printing, a droplet-based process, direct-write assembly involves the extrusion of ink filaments either in- or out-of-plane. The printed filaments typically conform to the nozzle size. Hence, microscale features (&lt; 1 &mu;m) can be patterned and assembled into larger arrays and multidimensional architectures.
In this paper, we first synthesize a highly concentrated silver nanoparticle ink for planar and 3D printing via direct-write assembly. Next, a standard protocol for printing microelectrodes in multidimensional motifs is demonstrated. Finally, applications of printed microelectrodes for electrically small antennas, solar cells, and light-emitting diodes are highlighted.

Planar and three-dimensional printing of conductive metallic inks is described. Our approach provides new avenues for fabricating printed electronic, optoelectronic, and biomedical devices in unusual layouts at the microscale.

導電性インクの平面および三次元印刷

Printed electronics rely on low-cost, large-area fabrication routes to create flexible or multidimensional electronic, optoelectronic, and biomedical ...

生物工学

Evaluating Plasmonic Transport in Current-carrying Silver Nanowires

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information support1,2,3. In this context, metal nanowires are especially desirable for realizing dense routing networks4. A prerequisite to operate such shared nanowire-based platform relies on our ability to electrically contact individual metal nanowires and efficiently excite surface plasmon polaritons5 in this information support. In this article, we describe a protocol to bring electrical terminals to chemically-synthesized silver nanowires6 randomly distributed on a glass substrate7. The positions of the nanowire ends with respect to predefined landmarks are precisely located using standard optical transmission microscopy before encapsulation in an electron-sensitive resist. Trenches representing the electrode layout are subsequently designed by electron-beam lithography. Metal electrodes are then fabricated by thermally evaporating a Cr/Au layer followed by a chemical lift-off. The contacted silver nanowires are finally transferred to a leakage radiation microscope for surface plasmon excitation and characterization8,9. Surface plasmons are launched in the nanowires by focusing a near infrared laser beam on a diffraction-limited spot overlapping one nanowire extremity5,9. For sufficiently large nanowires, the surface plasmon mode leaks into the glass substrate9,10. This leakage radiation is readily detected, imaged, and analyzed in the different conjugate planes in leakage radiation microscopy9,11. The electrical terminals do not affect the plasmon propagation. However, a current-induced morphological deterioration of the nanowire drastically degrades the flow of surface plasmons. The combination of surface plasmon leakage radiation microscopy with a simultaneous analysis of the nanowire electrical transport characteristics reveals the intrinsic limitations of such plasmonic circuitry.

Silver nanowires can simultaneously transport electrons and optical information in the form of surface plasmons. A procedure is described here to realize such a shared circuitry and the limitations at propagating both information carriers are evaluated.

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information ...

Fabrication of Anisotropic Polymeric Artificial Antigen Presenting Cells for CD8+ T Cell Activation

Artificial antigen presenting cells (aAPC) are a promising platform for immune modulation due to their potent ability to stimulate T cells. Acellular substrates offer key advantages over cell-based aAPC, including precise control of signal presentation parameters and physical properties of the aAPC surface to modulate its interactions with T cells. aAPC constructed from anisotropic particles, particularly ellipsoidal particles, have been shown to be more effective than their spherical counterparts at stimulating T cells due to increased binding and larger surface area available for T cell contact, as well as reduced nonspecific uptake and enhanced pharmacokinetic properties. Despite increased interest in anisotropic particles, even widely accepted methods of generating anisotropic particles such as thin-film stretching can be challenging to implement and use reproducibly.
To this end, we describe a protocol for the rapid, standardized fabrication of biodegradable anisotropic particle-based aAPC with tunable size, shape, and signal presentation for T cell expansion ex vivo or in vivo, along with methods to characterize their size, morphology, and surface protein content, and to assess their functionality. This approach to fabricating anisotropic aAPC is scalable and reproducible, making it ideal for generating aAPC for &#34;off-the-shelf&#34; immunotherapies.

Here, we present a protocol to quickly and reproducibly generate biologically inspired, biodegradable articifical antigen presenting cells (aAPC) with tunable size, shape, and surface protein presentation for T cell expansion ex vivo or in vivo.

異方性高分子人工抗原提示細胞 cd 8 + T 細胞活性化のための加工

Artificial antigen presenting cells (aAPC) are a promising platform for immune modulation due to their potent ability to stimulate T cells. Acellular ...

環境学

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a polymer film. This paper also presents a low-cost, vacuum-free fabrication method for this novel TE; the approach combines lithography, electroplating, and imprint transfer (LEIT) processing. The embedded nature of the EMTEs offers many advantages, such as high surface smoothness, which is essential for organic electronic device production; superior mechanical stability during bending; favorable resistance to chemicals and moisture; and strong adhesion with plastic film. LEIT fabrication features an electroplating process for vacuum-free metal deposition and is favorable for industrial mass production. Furthermore, LEIT allows for the fabrication of metal mesh with a high aspect ratio (i.e., thickness to linewidth), significantly enhancing its electrical conductance without adversely losing optical transmittance. We demonstrate several prototypes of flexible EMTEs, with sheet resistances lower than 1 &#937;/sq and transmittances greater than 90%, resulting in very high figures of merit (FoM) &#8211; up to 1.5 x 104 &#8211; which are amongst the best values in the published literature.

This protocol describes a solution-based fabrication strategy for high-performance, flexible, transparent electrodes with fully-embedded, thick metal mesh. Flexible transparent electrodes fabricated by this process demonstrate among the highest reported performances, including ultra-low sheet resistance, high optical transmittance, mechanical stability under bending, strong substrate adhesion, surface smoothness, and environmental stability.

埋め込み金属メッシュを用いた高性能で柔軟で透明な電極のための拡張可能なソリューション処理製作戦略

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a ...

Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of nanowires. DEP is used for nanowire analysis, characterization, and for solution-based fabrication of semiconducting devices. The method works by applying an alternating electric field between metallic electrodes. The nanowire formulation is then dropped onto the electrodes which are on an inclined surface to create a flow of the formulation using gravity. The nanowires then align along the gradient of the electric field and in the direction of the liquid flow. The frequency of the field can be adjusted to select nanowires with superior conductivity and lower trap density. 
In this work, flow-assisted DEP is used to create nanowire field effect transistors. Flow-assisted DEP has several advantages: it allows selection of nanowire electrical properties; control of nanowire length; placement of nanowires in specific areas; control of orientation of nanowires; and control of nanowire density in the device. 
The technique can be expanded to many other applications such as gas sensors and microwave switches. The technique is efficient, quick, reproducible, and it uses a minimal amount of dilute solution making it ideal for the testing of novel nanomaterials. Wafer scale assembly of nanowire devices can also be achieved using this technique, allowing large numbers of samples for testing and large-area electronic applications.

In this paper, flow assisted dielectrophoresis is demonstrated for the self-assembly of nanowire devices. The fabrication of a silicon nanowire field effect transistor is shown as an example.

誘電泳動の流れ支援: 高性能低温硬化型ナノワイヤ デバイス作製のための低コストの方法

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of ...

Fabrication of Robust Nanoscale Contact between a Silver Nanowire Electrode and CdS Buffer Layer in Cu(In,Ga)Se2 Thin-film Solar Cells

Silver nanowire transparent electrodes have been employed as window layers for Cu(In,Ga)Se2 thin-film solar cells. Bare silver nanowire electrodes normally result in very poor cell performance. Embedding or sandwiching silver nanowires using moderately conductive transparent materials, such as indium tin oxide or zinc oxide, can improve cell performance. However, the solution-processed matrix layers can cause a significant number of interfacial defects between transparent electrodes and the CdS buffer, which can eventually result in low cell performance. This manuscript describes how to fabricate robust electrical contact between a silver nanowire electrode and the underlying CdS buffer layer in a Cu(In,Ga)Se2 solar cell, enabling high cell performance using matrix-free silver nanowire transparent electrodes. The matrix-free silver nanowire electrode fabricated by our method proves that the charge-carrier collection capability of silver nanowire electrode-based cells is as good as that of standard cells with sputtered ZnO:Al/i-ZnO as long as the silver nanowires and CdS have high-quality electrical contact. The high-quality electrical contact was achieved by depositing an additional CdS layer as thin as 10 nm onto the silver nanowire surface.

Fabrication of Robust Nanoscale Contact between a Silver Nanowire Electrode and CdS Buffer Layer in CuIn,GaSe2 Thin-film Solar Cells

In this protocol, we describe the detailed experimental procedure for the fabrication of a robust nanoscale contact between a silver nanowire network and CdS buffer layer in a CIGS thin-film solar cell.

Cu(In,Ga)Se2薄膜太陽電池における銀ナノワイヤー電極とCdSバッファー層間の堅牢なナノスケール接触の製造

Silver nanowire transparent electrodes have been employed as window layers for Cu(In,Ga)Se2 thin-film solar cells. Bare silver nanowire electrodes ...

Iron Nanowire Fabrication by Nano-Porous Anodized Aluminum and its Characterization

Magnetic nanowires possess unique properties that have attracted the interest of different fields of research, including basic physics, biomedicine, and data storage. We demonstrate a fabrication method for iron (Fe) nanowires&#160;via electrochemical deposition into anodic&#160;alumina oxide (AAO) templates. The templates are fabricated by anodization of aluminum (Al) discs, and the pore length and diameter are controlled by changing the anodizing conditions. Pores with an average diameter of around 120 nm are created using oxalic acid as the electrolyte. Using this method, cylindrical nanowires are synthesized, which are released by dissolving the alumina using a selective chemical etchant.

In this work, we describe a&#160;protocol to fabricate iron nanowires, including the formation of the porous alumina membrane that is used as the template, electrodeposition into templates using electrolyte solution, and the release of the nanowires into the solution.

ナノ多孔質陽極酸化アルミニウムによる鉄ナノワイヤー製造とその特性

Magnetic nanowires possess unique properties that have attracted the interest of different fields of research, including basic physics, biomedicine, and ...

シルバーナノワイヤーと伸縮性の高い導体の製造方法

要約

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Nanoskivingによるナノギャップを作製

ファイバー描画法を用いたメタマテリアルの作製

3Dで切断された銀ナノ構造体を製造する方法

導電性インクの平面および三次元印刷

Evaluating Plasmonic Transport in Current-carrying Silver Nanowires

異方性高分子人工抗原提示細胞 cd 8 + T 細胞活性化のための加工

埋め込み金属メッシュを用いた高性能で柔軟で透明な電極のための拡張可能なソリューション処理製作戦略

誘電泳動の流れ支援: 高性能低温硬化型ナノワイヤデバイス作製のための低コストの方法

Cu(In,Ga)Se2薄膜太陽電池における銀ナノワイヤー電極とCdSバッファー層間の堅牢なナノスケール接触の製造

ナノ多孔質陽極酸化アルミニウムによる鉄ナノワイヤー製造とその特性

シルバーナノワイヤーと伸縮性の高い導体の製造方法

要約

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